International Conference On Advances In Civil Engineering And Chemistry Of Innovative Materials Chennai, India, Mar...

This conference aims to provide an outstanding opportunity for both academic and industrial communities alike to address new trends and challenges and emerging technologies on topics relevant to today's fast moving areas of Civil Engineering. The conference will feature invited talks and referred paper presentations. The vision of this International Conference is to serve as a platform for interaction among researchers and practitioners working in a wide variety of areas in Civil Engg with a common interest.

OBJECTIVES

  • The conference will give an opportunity to meet international experts and exchange views.
  • Presentations by Foreign and Indian experts will highlight the innovative works.
  • Provides the construction Industry with latest materials and technology.
  • Serves as a platform for knowledge sharing. 

  • Registration Fees:

    Academicians : Rs. 1,000 

    R & D/ Industry/ Corporate Executives : Rs. 2,000

    Government organizations Research Scholars : Rs. 1,000

    Post Graduate Students/Student Delegates : Rs. 600

    Foreign Delegates : USD 300

    Registration fee includes Course materials, Food & Snacks during the conference. Participants are requested to make their own arrangements for travel to venue and stay at Chennai. Organisers will assist for stay in Chennai and also guide for travel plan. One author is permitted for each registration. In the event of multiple authors, separate registrations are required.

    Payment Details

    Payment may be made in the form of DD/Cheque. DD along with the filled in registration form can be sent to,

    Dr. T. Ch. Madhavi
    Prof & Head of the Department of Civil Engineering
    SRM University, Ramapuram Campus
    Bharathi Salai, Chennai- 600 089

    Click Here to Download the Registration Form

    International Conference On Advances In Civil Engineering And Chemistry Of Innovative Materials Chennai, India, Mar...
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